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smd ? b EASV3020GRA1 features ? package in 8m m ta pe on 7 diamete r r eel. ? compatibl e wi th automati c pl acement equipment. ? compatibl e wi th infr ared an d vapo r p hase reflow solde r proc ess. ? mulit-color type. ? pb -free. ?t he produ c t itsel f wil l r e main within r ohs c ompliant version. ? complianc e with eu reach ?compliance halogen free .(br <900 ppm ,cl <900 ppm , br+cl < 1500 ppm). description ? the easv3020 smd led is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. ? besides, lightweight makes them ideal for miniature applications. etc. applications ?backlighting in dashboard and switch. ?t elecommunication: indicator and back-lighting in telephone and fax. ? flat back-light for lcd, switch and symbol. ?general use. page 1 of 11 rev. 0.01
device selection guide code chip materials emitted color resin color s 2 algainp brilliant orange water clear gv algainp green ) parameter symbol code rating unit reverse voltage v r 5 v forward current i f s 2 25 ma g v 25 p eak forward current (duty 1/10 @1khz) i fp s 2 60 ma g v 60 power dissipation pd s 2 60 mw g v 60 electrostatic discharge esd hbm s 2 2000 v g v 2000 operating temperature t opr - 40 ~ +85 storage temperature tstg - 40 ~ + 90 soldering temperature tsol reflow soldering : 260 for 1 0 sec. hand soldering : 350 for 3 sec. datasheet EASV3020GRA1 page 2 of 11 rev. 0.01
electro-optical characteristics (ta=25 ) p arameter symbol code min. typ. max. unit condition luminous intensity iv s 2 45.0 ----- 112 .0 mcd i f = 20 ma g v 18.0 ----- 45.0 viewing angle 2 1/2 ----- 120 ----- deg peak wavelength p s 2 ----- 611 ----- nm g v ----- 5 68 ----- dominant wavele ngth d s 2 ----- 605 ----- nm g v ----- 565 ----- spectrum radiation bandwidth s 2 ----- 17 ----- nm g v ----- 20 ----- forward voltage v f s 2 1.7 2.0 2.4 v g v 1.7 2.0 2.4 reverse current i r s 2 ----- ----- 10 a v r =5v g v ----- ----- 10 note: 1. tolerance of luminous intensity: 11% datasheet EASV3020GRA1 page 3 of 11 rev. 0.01
s2 bin range of luminous intensity bin min. max. unit condition p 45.0 72.0 mcd i f = 20 ma q 72.0 112 .0 bin min. max. unit condition m 18.0 28.5 mcd i f = 20 ma n 28.5 45.0 note: 1.tolerance of luminous intensity: 11% datasheet EASV3020GRA1 page 4 of 11 rev. 0.01
typical electro-optical characteristics curves s2 datasheet EASV3020GRA1 page 5 of 11 rev. 0.01
typical electro-optical characteristics curves gv datasheet EASV3020GRA1 page 6 of 11 rev. 0.01
package dimension note: tolerances unless mentioned 0.1mm. unit = mm datasheet EASV3020GRA1 page 7 of 11 rev. 0.01
moisture resistant packing materials label explanation ? cpn: customer s product number ? p/n: product number ? qty: packing quantity ? cat: luminous intensity rank ? hue: chromaticity coordinates & dom. wavelength rank ? ref: f orward voltage rank ? lot no: lot number note: the tolerances unless mentioned is 0.1mm ,unit = mm datasheet EASV3020GRA1 page 8 of 11 rev. 0.01
carrier tape dimensions: loaded quantity 2000 pcs per reel note: the tolerances unless mentioned is 0.1mm ,unit = mm moisture resistant packaging label desiccant label aluminum moisture-proof bag datasheet EASV3020GRA1 page 9 of 11 rev. 0.01
precautions for use 1. over-current-proof customer must apply resistors for protection, otherwise slight voltage shift will cause big current change ( burn out will happen ). 2. storage 2.1 do not open moisture proof bag before the products are ready to use. 2.2 before opening the package: the leds should be kept at 30 or l ess and 90%rh or less. 2.3 after opening the package: the led's floor life is 1 year under 30 or les s and 6 0% rh or less. if unused leds remain, it should be stored in moisture proof packages. 2. 4 if the moisture absorbent material (silica gel) has faded away or the leds have exceeded the storage time, baking treatment should be performed using the following conditions. baking treatment : 60 5 for 24 hours. 3. soldering condition 3.1 pb -free solder temperature profile 3.2 reflow soldering should not be done more than two times. 3.3 when soldering, do not put stress on the leds during heating. 3.4 after soldering, do not warp the circuit board. 4.soldering iron each terminal is to go to the tip of soldering iron temperature less than 350 for 3 seconds within once in less than the soldering iron capacity 25w. leave two seconds and more intervals, and do soldering of each terminal. be careful because the damage of the product is often started at the time of the hand solder. 5.repairing repair should not be done after the leds have been soldered. when repairing is unavoidable, a double-head soldering iron should be used (as below figure). it should be confirmed beforehand whether the characteristics of the leds will or will not be damaged by repairing. datasheet EASV3020GRA1 page 10 of 11 rev. 0.01
application restrictions high reliability applications such as military/aerospace, automotive safety/security systems, and medical equipment may require different product. if you have any concerns, please contact everlight before using this product in your application. this specification guarantees the quality and performance of the product as an individual component. do not use this product beyond the specification described in this document. datasheet EASV3020GRA1 page 11 of 11 rev. 0.01

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